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VAIO Z Series
The flagship models, this series realizes 16.65 mm thick full-flat bodies weighing 1.165 kg, while being fitted with high-performance multi-core CPUs. The exteriors feature lightweight yet rigid carbon materials; while aluminum is used for the palm rests. Form follows function, with the hexagonal cross-section of the hexa-shell structure producing a light, thin and strong body. The striking concealed hinge at the back represents an entirely new structure, producing a simple and beautiful back with fully concealed hinge, and making the units beautiful and robust whether open or closed.
发布于2019-11-28
设计公司
Sony Corporation
设计师
Yujin Morisawa
设计奖项

德国iF设计奖

iF DESIGN AWARD/iF设计奖

2012 年

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