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ASUS Motherboard R3
The new high performance gaming main board from ASUSTek introduces a revolution in heat sync design. Inspired by crystal structures it increases the efficiency of cooling, which allows for better performance and easier assembly. Using the fins as esthetic elements, we capture a feeling of unique dynamism without the need for additional parts as used in previous versions of this product. This makes it easier to assemble, decreasing the fail rate and risk of damaging other highly fragile parts, also an advantage for many of our consumers, who customize the boards themselves after buying them.
发布于2019-11-28
设计公司
ASUSTEK COMPUTER INC.
设计奖项

德国iF设计奖

iF DESIGN AWARD/iF设计奖

2011 年

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