首页
项目管理
灵魂场景
社区
产品库
设计案例
INGO铟果集
铟立方
服务商入驻
登录/注册
1/1
Fidelio X1
The Fidelio X1 headphones have double-layered ear cups engineered to reduce unwanted resonance and vibration. The open-back acoustic architecture eliminates air pressure build-up behind the driver, thus allowing free movement of the diaphragm. External hinges and component parts consist of machined aluminium, making the headphones very solid and simultaneously lightweight. Memory foam ear pads and a leather headband guarantee a good fit.
发布于2020-10-29
设计师
Royal Philips, Royal Philips Electronics, Philips Design Consumer Lifestyle Team, Netherlands
设计奖项

德国红点设计奖

Red Dot/红点奖

2013 年

颜色
最新评论
相关推荐